HIGHCVSS 7.8Actively exploited · CISA KEV since 2026-03-03Vulnerability

CVE-2026-21385

Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation.

Properties

Euvd product
Snapdragon
Vulnerability name
Qualcomm Multiple Chipsets Memory Corruption Vulnerability
First seen
2026-03-04T04:55:16+00:00
Cvss score
7.8
Epss score
0.01293
Last seen
2026-10-19T12:00:27+00:00
Due date
2026-03-24
Euvd assigner
qualcomm
Retrieved at
2026-10-21T01:24:49+00:00
Exploited euvd since
2026-03-03T00:00:00+00:00
Src batch id
epss_history-20261020T103617Z-728ddd
Source url
https://epss.empiricalsecurity.com/epss_scores-2026-10-19.csv.gz
Date added
2026-03-03
Score
7.8
Euvd base score version
3.1
Fetched at
2026-10-20T10:36:20+00:00
Euvd vendor
Qualcomm, Inc.
Cvss vector
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
In Signal since
initial import (Sep 2026)
Euvd base score
7.8

Related Entities (478 · showing 24)

AFFECTS_PRODUCT (474 · showing 20)

→[Product]cpe:2.3:o:qualcomm:snapdragon_6_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sdm429w:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sm7550_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm7550p:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sm7675_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sm7550p_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sdx61:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm7325p:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sdx61_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sm7435_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm7435:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm7550:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm7635p:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm7675:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sm6225p_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm6225p:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:sm6650p:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*

DESCRIBES (1)

←[KEVEntry]Qualcomm Multiple Chipsets Memory Corruption Vulnerability

HAS_WEAKNESS (1)

→[Weakness]Integer Overflow or Wraparound

INVOLVES (1)

←[Signal]kev_added · 2026-03-03

MENTIONED_IN (1)

→[Campaign]March 2026 CVE Landscape: 31 High-Impact Vulnerabilities Identified, Interlock Ransomware Group Exploits Cisco FMC Zero-Day

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CVE-2026-21385 (CVSS 7.8) — Ninja Signal Threat Intelligence | Ninja Signal