HIGHCVSS v3.1 7.8Actively exploited · CISA KEV since 2023-12-05Vulnerability

CVE-2022-22071

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

Properties

Euvd product
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Vulnerability name
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
First seen
2025-10-21T23:15:38+00:00
Cvss score
7.8
Epss score
0.00411
Last seen
2026-10-19T12:00:27+00:00
Due date
2023-12-26
Euvd assigner
qualcomm
Retrieved at
2026-10-21T01:24:47+00:00
Exploited euvd since
2023-12-05T00:00:00+00:00
Src batch id
epss_history-20261020T103617Z-728ddd
Source url
https://epss.empiricalsecurity.com/epss_scores-2026-10-19.csv.gz
Date added
2023-12-05
Score
7.8
Euvd base score version
3.1
Fetched at
2026-10-20T10:36:20+00:00
Euvd vendor
Qualcomm, Inc.
Cvss vector
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
In Signal since
initial import (Sep 2026)
Euvd base score
8.4

Related Entities (183 · showing 23)

AFFECTS_PRODUCT (180 · showing 20)

→[Product]cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wsa8830:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wsa8835:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wcn6850:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wcn6750:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wcn6856:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wcn6855:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wcn7851:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wcn7850:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:h:qualcomm:wsa8815:-:*:*:*:*:*:*:*
→[Product]cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*

DESCRIBES (1)

←[KEVEntry]Qualcomm Multiple Chipsets Use-After-Free Vulnerability

HAS_WEAKNESS (1)

→[Weakness]Use After Free

INVOLVES (1)

←[Signal]kev_added · 2023-12-05

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CVE-2022-22071 (CVSS v3.1 7.8) — Ninja Signal Threat Intelligence | Ninja Signal